DUBLIN–(BUSINESS WIRE)–The “2022 Recap and 2023 Development of the Global IC Packaging and Testing Industry” report has been added to ResearchAndMarkets.com’s offering.
In 2022, the semiconductor industry continued to grapple with weak consumption momentum in major economies, primarily due to adverse factors such as high inflation rates and the Russia-Ukraine war. Since the first half of 2022, global chip supply has surpassed demand, marking the end of the price and shipment volume surge that witnessed in the IC packaging and testing industry in 2021.
Shipment value of the global IC packaging and testing industry, also known as the OSAT (Outsourced Semiconductor Assembly and Testing) industry, reached nearly US$40 billion in 2022, representing modest year-on-year growth of 1.3% compared to 2021.
This report examines the developments of the global IC packaging and testing industry and key industry players throughout 2022; it also explores the development of the global IC packaging and testing industry amid declining consumer electronics demand and the volatile global economy.
Key Topics Covered:
1. Recap of the Global IC Packaging and Testing Industry in 2022
1.1 Market Size and Top Ten OSAT Rankings in the Global IC Packaging and Testing Industry in 2022
1.2 Overall Performance of the Global IC Packaging and Testing Industry in 2022
2. Operational Performance of Major OSAT Companies in 2022
2.1 ASE Holdings, PTI, KYEC
2.2 Amkor, JCET
3. Outlook for the Global IC Packaging and Testing Industry
3.1 OSATs Shifting Focus to Automotive Chips While Consumer Electronics Demand Weakening
3.2 Leading Players Accelerate Advanced Packaging Technology Development to Meet Emerging HPC and AI Application Trends
A selection of companies mentioned in this report includes
- AMD
- Amkor
- Analog Devices
- ASE
- Chipbond
- Chrysler
- Ford
- General Motors
- GlobalFoundries
- Greatek Electronics
- Hana Micron
- Huatian Technology
- Intel
- JCET
- Longsys
- MediaTek
- Micron Technology
- Nanya
- Nvidia
- OpenAI
- Powertech Technology
- PTI
- Samsung
- Sigurd Microelectronics
- SK Hynix
- SPIL
- STATS ChipPAC
- Tera Probe
- TeraPower Technology
- TFME
- TSMC
- Xilinx
For more information about this report visit https://www.researchandmarkets.com/r/n7g71m
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